 | 2009 |
| 7 |  | John F. McDonald,
Okan Erdogan,
Philip Jacob,
Paul M. Belemjian,
Alexey Gutin,
Aamir Zia,
Michael Chu,
Jin Woo Kim,
Ryan Clarke,
Nate DeSimone,
Sherry Liu,
Russell P. Kraft:
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.
3DIC 2009: 1-7 |
| 2007 |
| 6 |  | Phil Jacobs,
Aamir Zia,
Okan Erdogan,
Paul M. Belemjian,
Peng Jin,
Jin Woo Kim,
Michael Chu,
Russell P. Kraft,
John F. McDonald:
Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.
ICCD 2007: 202-207 |
| 2005 |
| 5 |  | Jong-Ru Guo,
Chao You,
Michael Chu,
Okan Erdogan,
Russell P. Kraft,
John F. McDonald:
A High Speed Reconfigurable Gate Array for Gigahertz Applications.
ISVLSI 2005: 124-129 |
| 4 |  | Philip Jacob,
Okan Erdogan,
Aamir Zia,
Paul M. Belemjian,
Russell P. Kraft,
John F. McDonald:
Predicting the Performance of a 3D Processor-Memory Chip Stack.
IEEE Design & Test of Computers 22(6): 540-547 (2005) |
| 2004 |
| 3 |  | Jong-Ru Guo,
Chao You,
Michael Chu,
Robert W. Heikaus,
Kuan Zhou,
Okan Erdogan,
Jiedong Diao,
Bryan S. Goda,
Russell P. Kraft,
John F. McDonald:
The gigahertz FPGA: design consideration and applications.
FPGA 2004: 248 |
| 2003 |
| 2 |  | John Mayega,
Okan Erdogan,
Paul M. Belemjian,
Kuan Zhou,
John F. McDonald,
Russell P. Kraft:
3D direct vertical interconnect microprocessors test vehicle.
ACM Great Lakes Symposium on VLSI 2003: 141-146 |
| 1 |  | Chao You,
Jong-Ru Guo,
Russell P. Kraft,
Michael Chu,
Robert W. Heikaus,
Okan Erdogan,
Peter F. Curran,
Bryan S. Goda,
Kuan Zhou,
John F. McDonald:
Gigahertz FPGA by SiGe BiCMOS Technology for Low Power, High Speed Computing with 3-D Memory.
FPL 2003: 11-20 |