Bernd Ebersberger

	2008
5		Alfred Yeo, Bernd Ebersberger, Charles Lee: Consideration of temperature and current stress testing on flip chip solder interconnects. Microelectronics Reliability 48(11-12): 1847-1856 (2008)
	2001
4		Uwe Cantner, Bernd Ebersberger, Horst Hanusch, Jens J. Krüger, Andreas Pyka: Empirically Based Simulation: The Case of Twin Peaks in National Income. J. Artificial Societies and Social Simulation 4(3): (2001)
3		M. Porti, X. Blasco, M. Nafría, X. Aymerich, Alexander Olbrich, Bernd Ebersberger: Local current fluctuations before and after breakdown of thin SiO2 films observed with conductive atomic force microscope. Microelectronics Reliability 41(7): 1041-1044 (2001)
2		Bernd Ebersberger, Alexander Olbrich, Christian Boit: Scanning probe microscopy in semiconductor failure analysis. Microelectronics Reliability 41(8): 1231-1236 (2001)
1		Bernd Ebersberger, Alexander Olbrich, Christian Boit: Application of Scanning Probe Microscopy techniques in Semiconductor Failure Analysis. Microelectronics Reliability 41(9-10): 1449-1458 (2001)

Coauthor Index

1	X. Aymerich	[3]
2	X. Blasco	[3]
3	Christian Boit	[1] [2]
4	Uwe Cantner	[4]
5	Horst Hanusch	[4]
6	Jens J. Krüger	[4]
7	Charles Lee	[5]
8	M. Nafría	[3]
9	Alexander Olbrich	[1] [2] [3]
10	M. Porti	[3]
11	Andreas Pyka	[4]
12	Alfred Yeo	[5]

Colors in the list of coauthors

Last update Tue May 29 20:41:18 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page