Andrzej Dziedzic

	2011
18		Andrzej Dziedzic: 10th Electron Technology ELTE 2010 and 34th International Microelectronics and Packaging IMAPS/CPMT Poland Joint Conference - Guest Editorial. Microelectronics Reliability 51(7): 1157-1158 (2011)
17		Damian Nowak, Andrzej Dziedzic: LTCC package for high temperature applications. Microelectronics Reliability 51(7): 1241-1244 (2011)
	2009
16		Andrzej Dziedzic: IMAPS-CPMT Poland 2008 - Guest Editorial. Microelectronics Reliability 49(6): 567-568 (2009)
15		Damian Nowak, Edward Mis, Andrzej Dziedzic, Jaroslaw Kita: Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors. Microelectronics Reliability 49(6): 600-606 (2009)
14		Edward Mis, Andrzej Dziedzic, Witold Mielcarek: Microvaristors in thick-film and LTCC circuits. Microelectronics Reliability 49(6): 607-613 (2009)
	2008
13		Andrzej Dziedzic: IMAPS Poland 2007 - Guest Editorial. Microelectronics Reliability 48(6): 859 (2008)
12		K. Mleczko, Z. Zawislak, A. W. Stadler, Andrzej Kolek, Andrzej Dziedzic, J. Cichosz: Evaluation of conductive-to-resistive layers interaction in thick-film resistors. Microelectronics Reliability 48(6): 881-885 (2008)
11		Piotr Markowski, Andrzej Dziedzic: Planar and three-dimensional thick-film thermoelectric microgenerators. Microelectronics Reliability 48(6): 890-896 (2008)
	2007
10		Andrzej Dziedzic, Jan Felba: Polytronic 2005. Microelectronics Reliability 47(2-3): 327 (2007)
9		Andrzej Dziedzic: Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties. Microelectronics Reliability 47(2-3): 354-362 (2007)
	2006
8		Andrzej Dziedzic, Andrzej Kolek, Waleed Ehrhardt, Heiko Thust: Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors. Microelectronics Reliability 46(2-4): 352-359 (2006)
	2005
7		Andrzej Dziedzic: IMAPS Poland 2004 - Guest Editorial. Microelectronics Reliability 45(12): 1901-1902 (2005)
6		Darko Belavic, Marko Hrovat, Jaroslaw Kita, Janez Holc, Jena Cilensek, Leszek J. Golonka, Andrzej Dziedzic: Evaluation of compatibility of thick-film PTC thermistors and LTCC structures. Microelectronics Reliability 45(12): 1924-1929 (2005)
5		Marek Wronski, Slawomir Kaminski, Edward Mis, Andrzej Dziedzic: New trim configurations for laser trimmed thick-film resistors - theoretical analysis, numerical simulation and experimental verification. Microelectronics Reliability 45(12): 1941-1948 (2005)
	2003
4		Andrzej Dziedzic: Special Section on IMAPS-Europe 2002. Microelectronics Reliability 43(3): 343 (2003)
3		Andrzej Dziedzic, Lars Rebenklau, Leszek J. Golonka, Klaus-Jürgen Wolter: Fodel microresistors-processing and basic electrical properties. Microelectronics Reliability 43(3): 377-383 (2003)
	2002
2		Andrzej Dziedzic: Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components. Microelectronics Reliability 42(4-5): 709-719 (2002)
	2001
1		Andrzej Dziedzic, Leszek J. Golonka, Jaroslaw Kita, Heiko Thust, Karl-Heinz Drue, Reinhard Bauer, Lars Rebenklau, Klaus-Jürgen Wolter: Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors. Microelectronics Reliability 41(5): 669-676 (2001)

Coauthor Index

1	Reinhard Bauer	[1]
2	Darko Belavic	[6]
3	J. Cichosz	[12]
4	Jena Cilensek	[6]
5	Karl-Heinz Drue	[1]
6	Waleed Ehrhardt	[8]
7	Jan Felba	[10]
8	Leszek J. Golonka	[1] [3] [6]
9	Janez Holc	[6]
10	Marko Hrovat	[6]
11	Slawomir Kaminski	[5]
12	Jaroslaw Kita	[1] [6] [15]
13	Andrzej Kolek	[8] [12]
14	Piotr Markowski	[11]
15	Witold Mielcarek	[14]
16	Edward Mis	[5] [14] [15]
17	K. Mleczko	[12]
18	Damian Nowak	[15] [17]
19	Lars Rebenklau	[1] [3]
20	A. W. Stadler	[12]
21	Heiko Thust	[1] [8]
22	Klaus-Jürgen Wolter	[1] [3]
23	Marek Wronski	[5]
24	Z. Zawislak	[12]

Colors in the list of coauthors

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