Robi Dutta

	2010
5		Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong: Effective congestion reduction for IC package substrate routing. ACM Trans. Design Autom. Electr. Syst. 15(3): (2010)
	2009
4		Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong: Diffusion-driven congestion reduction for substrate topological routing. ISPD 2009: 175-180
3		Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong: Substrate Topological Routing for High-Density Packages. IEEE Trans. on CAD of Integrated Circuits and Systems 28(2): 207-216 (2009)
	2008
2		Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong: Topological routing to maximize routability for package substrate. DAC 2008: 566-569
	1990
1		Robi Dutta, Maurice Marks, Craig Morrissey, Ravi Rao, Lee Sapiro: A flexible hierarchical 3-D module assembler. EURO-DAC 1990: 124-128

Coauthor Index

1	Guoqiang Chen	[2] [3] [4] [5]
2	Lei He	[2] [3] [4] [5]
3	Xianlong Hong	[2] [3] [4] [5]
4	Tom Tong Jing	[2] [3] [4] [5]
5	Shenghua Liu	[2] [3] [4] [5]
6	Maurice Marks	[1]
7	Craig Morrissey	[1]
8	Ravi Rao	[1]
9	Lee Sapiro	[1]
10	Tianpei Zhang	[2] [3]

Colors in the list of coauthors

Last update Tue May 29 20:41:18 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page