J. M. Dorkel

	2012
4		E. Marcault, M. Breil, A. Bourennane, P. Tounsi, J. M. Dorkel: Study of mechanical stress impact on the I-V characteristics of a power VDMOS device using 2D FEM simulations. Microelectronics Reliability 52(3): 489-496 (2012)
	2009
3		B. Bernoux, R. Escoffier, P. Jalbaud, J. M. Dorkel: Source electrode evolution of a low voltage power MOSFET under avalanche cycling. Microelectronics Reliability 49(9-11): 1341-1345 (2009)
	2005
2		B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M. Legros, A. Deram, C. Levade, G. Vanderschaeve, J. M. Dorkel, J. P. Fradin: Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. Microelectronics Reliability 45(9-11): 1717-1722 (2005)
	2002
1		O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi: Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability 42(7): 1053-1058 (2002)

Coauthor Index

1	B. Bernoux	[3]
2	A. Bourennane	[4]
3	M. Breil	[4]
4	X. Chauffleur	[2]
5	Y. S. Chung	[1]
6	A. Deram	[2]
7	Ph. Dupuy	[2]
8	R. Escoffier	[3]
9	J. P. Fradin	[2]
10	P. Jalbaud	[3]
11	B. Khong	[2]
12	M. Legros	[2]
13	C. Levade	[2]
14	E. Marcault	[4]
15	O. Perat	[1]
16	A. Peyre-Lavigne	[1]
17	E. Scheid	[1]
18	Pierre Temple-Boyer	[1]
19	P. Tounsi	[1] [2] [4]
20	G. Vanderschaeve	[2]
21	M. Zecri	[1]

Colors in the list of coauthors

Last update Tue May 29 20:41:18 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page