 | 2011 |
| 22 |  | Xiangyu Dong,
Yuan Xie:
AdaMS: Adaptive MLC/SLC phase-change memory design for file storage.
ASP-DAC 2011: 31-36 |
| 21 |  | Jishen Zhao,
Xiangyu Dong,
Yuan Xie:
An energy-efficient 3D CMP design with fine-grained voltage scaling.
DATE 2011: 539-542 |
| 20 |  | Cong Xu,
Xiangyu Dong,
Norman P. Jouppi,
Yuan Xie:
Design implications of memristor-based RRAM cross-point structures.
DATE 2011: 734-739 |
| 19 |  | Xiangyu Dong,
Junqiang Xi:
The study of shift strategy for pure electric bus without synchronizer.
EMEIT 2011: 2557-2562 |
| 18 |  | Jue Wang,
Xiangyu Dong,
Guangyu Sun,
Dimin Niu,
Yuan Xie:
Energy-efficient multi-level cell phase-change memory system with data encoding.
ICCD 2011: 175-182 |
| 17 |  | Asit K. Mishra,
Xiangyu Dong,
Guangyu Sun,
Yuan Xie,
Narayanan Vijaykrishnan,
Chita R. Das:
Architecting on-chip interconnects for stacked 3D STT-RAM caches in CMPs.
ISCA 2011: 69-80 |
| 16 |  | Guangyu Sun,
Yibo Chen,
Xiangyu Dong,
Jin Ouyang,
Yuan Xie:
Three-dimensional Integrated Circuits: Design, EDA, and Architecture.
Foundations and Trends in Electronic Design Automation 5(1-2): 1-151 (2011) |
| 15 |  | Xiangyu Dong,
Xiaoxia Wu,
Yuan Xie,
Yiran Chen,
Hai Helen Li:
Stacking magnetic random access memory atop microprocessors: an architecture-level evaluation.
IET Computers & Digital Techniques 5(3): 213-220 (2011) |
| 14 |  | Xiangyu Dong,
Yuan Xie,
Naveen Muralimanohar,
Norman P. Jouppi:
Hybrid checkpointing using emerging nonvolatile memories for future exascale systems.
TACO 8(2): 6 (2011) |
| 2010 |
| 13 |  | Jing Xie,
Xiangyu Dong,
Yuan Xie:
3D memory stacking for fast checkpointing/restore applications.
3DIC 2010: 1-6 |
| 12 |  | Dimin Niu,
Yibo Chen,
Xiangyu Dong,
Yuan Xie:
Energy and performance driven circuit design for emerging phase-change memory.
ASP-DAC 2010: 193-198 |
| 11 |  | Jishen Zhao,
Xiangyu Dong,
Yuan Xie:
Cost-aware three-dimensional (3D) many-core multiprocessor design.
DAC 2010: 126-131 |
| 10 |  | Xiaoxia Wu,
Guangyu Sun,
Xiangyu Dong,
Reetuparna Das,
Yuan Xie,
Chita R. Das,
Jian Li:
Cost-driven 3D integration with interconnect layers.
DAC 2010: 150-155 |
| 9 |  | Yongsoo Joo,
Dimin Niu,
Xiangyu Dong,
Guangyu Sun,
Naehyuck Chang,
Yuan Xie:
Energy- and endurance-aware design of phase change memory caches.
DATE 2010: 136-141 |
| 8 |  | Xiangyu Dong,
Yuan Xie,
Naveen Muralimanohar,
Norman P. Jouppi:
Simple but Effective Heterogeneous Main Memory with On-Chip Memory Controller Support.
SC 2010: 1-11 |
| 7 |  | Xiangyu Dong,
Jishen Zhao,
Yuan Xie:
Fabrication Cost Analysis and Cost-Aware Design Space Exploration for 3-D ICs.
IEEE Trans. on CAD of Integrated Circuits and Systems 29(12): 1959-1972 (2010) |
| 2009 |
| 6 |  | Xiangyu Dong,
Yuan Xie:
System-level cost analysis and design exploration for three-dimensional integrated circuits (3D ICs).
ASP-DAC 2009: 234-241 |
| 5 |  | Guangyu Sun,
Xiangyu Dong,
Yuan Xie,
Jian Li,
Yiran Chen:
A novel architecture of the 3D stacked MRAM L2 cache for CMPs.
HPCA 2009: 239-249 |
| 4 |  | Xiangyu Dong,
Norman P. Jouppi,
Yuan Xie:
PCRAMsim: System-level performance, energy, and area modeling for Phase-Change RAM.
ICCAD 2009: 269-275 |
| 3 |  | Ahmed Al-Maashri,
Guangyu Sun,
Xiangyu Dong,
Vijay Narayanan,
Yuan Xie:
3D GPU architecture using cache stacking: Performance, cost, power and thermal analysis.
ICCD 2009: 254-259 |
| 2 |  | Xiangyu Dong,
Naveen Muralimanohar,
Norman P. Jouppi,
Richard Kaufmann,
Yuan Xie:
Leveraging 3D PCRAM technologies to reduce checkpoint overhead for future exascale systems.
SC 2009 |
| 2008 |
| 1 |  | Xiangyu Dong,
Xiaoxia Wu,
Guangyu Sun,
Yuan Xie,
Hai Helen Li,
Yiran Chen:
Circuit and microarchitecture evaluation of 3D stacking magnetic RAM (MRAM) as a universal memory replacement.
DAC 2008: 554-559 |