![]() | ![]() |
| 2003 | ||
|---|---|---|
| 3 | G. Lefranc, B. Weiss, C. Klos, J. Dick, G. Khatibi, H. Berg: Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectronics Reliability 43(9-11): 1833-1838 (2003) | |
| 1996 | ||
| 2 | D. Maisey, J. Dick: Measuring the quality of the development lifecycle process. Software Quality Journal 5(3): 199-210 (1996) | |
| 1994 | ||
| 1 | I. D. Dear, Chryssa Dislis, Anthony P. Ambler, J. Dick: Test strategy planning using economic analysis. J. Electronic Testing 5(2-3): 137-155 (1994) | |
| 1 | Anthony P. Ambler | [1] |
| 2 | H. Berg | [3] |
| 3 | I. D. Dear | [1] |
| 4 | Chryssa Dislis | [1] |
| 5 | G. Khatibi | [3] |
| 6 | C. Klos | [3] |
| 7 | G. Lefranc | [3] |
| 8 | D. Maisey | [2] |
| 9 | B. Weiss | [3] |
Colors in the list of coauthors
Last update Tue May 29 20:41:18 2012 CET by the DBLP Team —
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