 | 2008 |
| 5 |  | P. Schwindenhammer,
H. Murray,
Ph. Descamps,
P. Poirier:
Determination of temperature change inside IC packages during laser ablation of molding compound.
Microelectronics Reliability 48(8-9): 1263-1267 (2008) |
| 2005 |
| 4 |  | D. Abessolo-Bidzo,
P. Poirier,
Ph. Descamps,
B. Domengès:
Isolating failing sites in IC packages using time domain reflectometry: Case studies.
Microelectronics Reliability 45(9-11): 1639-1644 (2005) |
| 2003 |
| 3 |  | O. Crépel,
Romain Desplats,
Y. Bouttement,
Philippe Perdu,
C. Goupil,
Ph. Descamps,
Felix Beaudoin,
L. Marina:
Magnetic emission mapping for passive integrated components characterisation.
Microelectronics Reliability 43(9-11): 1809-1814 (2003) |
| 2002 |
| 2 |  | B. Domengès,
P. Schwindenhammer,
P. Poirier,
Felix Beaudoin,
Ph. Descamps:
Comprehensive failure analysis of leakage faults in bipolar transistors.
Microelectronics Reliability 42(9-11): 1449-1452 (2002) |
| 1 |  | O. Crépel,
C. Goupil,
B. Domengès,
Ph. Descamps,
Philippe Perdu,
A. Doukkali:
Magnetic field measurements for Non Destructive Failure Analysis.
Microelectronics Reliability 42(9-11): 1763-1766 (2002) |