A. Deram

	2009
3		J. B. Sauveplane, E. Scheid, A. Deram: On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi1% chip metallization of a power semiconductor device. Microelectronics Reliability 49(5): 499-505 (2009)
	2008
2		J. B. Sauveplane, P. Tounsi, E. Scheid, A. Deram: 3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET. Microelectronics Reliability 48(8-9): 1464-1467 (2008)
	2005
1		B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M. Legros, A. Deram, C. Levade, G. Vanderschaeve, J. M. Dorkel, J. P. Fradin: Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. Microelectronics Reliability 45(9-11): 1717-1722 (2005)

Coauthor Index

1	X. Chauffleur	[1]
2	J. M. Dorkel	[1]
3	Ph. Dupuy	[1]
4	J. P. Fradin	[1]
5	B. Khong	[1]
6	M. Legros	[1]
7	C. Levade	[1]
8	J. B. Sauveplane	[2] [3]
9	E. Scheid	[2] [3]
10	P. Tounsi	[1] [2]
11	G. Vanderschaeve	[1]

Last update Tue May 29 01:28:40 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page