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| 2005 | ||
|---|---|---|
| 1 | J. de Vries, J. van Delft, C. Slob: 100 mum Pitch flip chip on foil assemblies with adhesive interconnections. Microelectronics Reliability 45(3-4): 527-534 (2005) | |
| 1 | C. Slob | [1] |
| 2 | J. de Vries | [1] |
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