 | 2011 |
|---|
| 14 |       | Basab Datta,
Wayne Burleson:
A 45.6μ2 13.4μw 7.1v/v resolution sub-threshold based digital process-sensing circuit in 45nm CMOS.
ACM Great Lakes Symposium on VLSI 2011: 133-138 |
| 13 | | Basab Datta,
Wayne Burleson:
A high sensitivity and process tolerant digital thermal sensing scheme for 3-D Ics.
ACM Great Lakes Symposium on VLSI 2011: 289-294 |
| 12 | | Basab Datta,
Wayne Burleson:
A 12.4μm2 133.4μW 4.56mV/°C resolution digital on-chip thermal sensing circuit in 45nm CMOS utilizing sub-threshold operation.
ISQED 2011: 67-73 |
| 11 | | Basab Datta,
Wayne Burleson:
Temperature Effects on Practical Energy Optimization of Sub-Threshold Circuits in Deep Nanometer Technologies.
J. Low Power Electronics 7(3): 403-419 (2011) |
| 2010 |
|---|
| 10 | | Jia Zhao,
Basab Datta,
Wayne P. Burleson,
Russell Tessier:
Thermal-aware voltage droop compensation for multi-core architectures.
ACM Great Lakes Symposium on VLSI 2010: 335-340 |
| 9 | | Basab Datta,
Wayne Burleson:
Analysis and mitigation of NBTI-impact on PVT variability in repeated global interconnect performance.
ACM Great Lakes Symposium on VLSI 2010: 341-346 |
| 8 | | Basab Datta,
Wayne P. Burleson:
Circuit-level NBTI macro-models for collaborative reliability monitoring.
ACM Great Lakes Symposium on VLSI 2010: 453-458 |
| 7 | | Basab Datta,
Wayne P. Burleson:
Calibration of on-chip thermal sensors using process monitoring circuits.
ISQED 2010: 461-467 |
| 2009 |
|---|
| 6 | | Basab Datta,
Wayne P. Burleson:
Low-power, process-variation tolerant on-chip thermal monitoring using track and hold based thermal sensors.
ACM Great Lakes Symposium on VLSI 2009: 145-148 |
| 5 | | Basab Datta,
Wayne Burleson:
On temperature planarization effect of copper dummy fills in deep nanometer technology.
ISQED 2009: 494-499 |
| 4 | | Basab Datta,
Wayne Burleson:
Temperature effects on energy optimization in sub-threshold circuit design.
ISQED 2009: 680-685 |
| 2008 |
|---|
| 3 | | Basab Datta,
Wayne Burleson:
Collaborative sensing of on-chip wire temperatures using interconnect based ring oscillators.
ACM Great Lakes Symposium on VLSI 2008: 41-46 |
| 2 | | Basab Datta,
Wayne P. Burleson:
Temperature measurement in Content Addressable Memory cells using bias-controlled VCO.
SoCC 2008: 147-150 |
| 2007 |
|---|
| 1 | | Basab Datta,
Wayne P. Burleson:
Low power on-chip thermal sensors based on wires.
VLSI-SoC 2007: 258-263 |
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