 | 2011 |
| 30 |  | Vezio Malandruccolo,
Mauro Ciappa,
Hubert Rothleitner,
Wolfgang Fichtner:
A New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment.
J. Electronic Testing 27(1): 19-30 (2011) |
| 29 |  | Mauro Ciappa,
Luigi Mangiacapra,
Maria Stangoni,
Stephan Ott,
Wolfgang Fichtner:
Design of optimum electron beam irradiation processes for the reliability of electric cables used in critical applications.
Microelectronics Reliability 51(9-11): 1479-1483 (2011) |
| 28 |  | Aniello Esposito,
Mauro Ciappa,
Wolfgang Fichtner:
Synthesis of scanning electron microscopy images by high performance computing for the metrology of advanced CMOS processes.
Microelectronics Reliability 51(9-11): 1673-1678 (2011) |
| 2010 |
| 27 |  | Vezio Malandruccolo,
Mauro Ciappa,
Wolfgang Fichtner,
Hubert Rothleitner:
Novel built-in methodology for defect testing of capacitor oxide in SAR analog to digital converters for critical automotive applications.
European Test Symposium 2010: 170-174 |
| 26 |  | Mauro Ciappa,
Alexander Koschik,
Maurizio Dapor,
Wolfgang Fichtner:
Modeling secondary electron images for linewidth measurement by critical dimension scanning electron microscopy.
Microelectronics Reliability 50(9-11): 1407-1412 (2010) |
| 25 |  | Yuji Sasaki,
Mauro Ciappa,
Takayuki Masunaga,
Wolfgang Fichtner:
Accurate extraction of the mechanical properties of thin films by nanoindentation for the design of reliable MEMS.
Microelectronics Reliability 50(9-11): 1621-1625 (2010) |
| 24 |  | Vezio Malandruccolo,
Mauro Ciappa,
Hubert Rothleitner,
M. Hommel,
Wolfgang Fichtner:
A new built-in screening methodology for Successive Approximation Register Analog to Digital Converters.
Microelectronics Reliability 50(9-11): 1750-1757 (2010) |
| 2009 |
| 23 |  | Vezio Malandruccolo,
Mauro Ciappa,
Wolfgang Fichtner,
Hubert Rothleitner:
Novel Solution for the Built-in Gate Oxide Stress Test of LDMOS in Integrated Circuits for Automotive Applications.
European Test Symposium 2009: 67-72 |
| 22 |  | Haruka Kubo,
Mauro Ciappa,
Takayuki Masunaga,
Wolfgang Fichtner:
Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices.
Microelectronics Reliability 49(9-11): 1278-1282 (2009) |
| 21 |  | Vezio Malandruccolo,
Mauro Ciappa,
Hubert Rothleitner,
Wolfgang Fichtner:
A new built-in screening methodology to achieve zero defects in the automotive environment.
Microelectronics Reliability 49(9-11): 1334-1340 (2009) |
| 20 |  | Mauro Ciappa,
Luigi Mangiacapra,
Maria Stangoni,
Stephan Ott,
Wolfgang Fichtner:
Ensuring the reliability of electron beam crosslinked electric cables by the optimization of the dose depth distribution with Monte Carlo simulation.
Microelectronics Reliability 49(9-11): 972-976 (2009) |
| 2008 |
| 19 |  | Alberto Castellazzi,
Mauro Ciappa:
Novel simulation approach for transient analysis and reliable thermal management of power devices.
Microelectronics Reliability 48(8-9): 1500-1504 (2008) |
| 2007 |
| 18 |  | Ulrich Glaser,
Kai Esmark,
Martin Streibl,
Christian Russ,
Krzysztof Domanski,
Mauro Ciappa,
Wolfgang Fichtner:
SCR operation mode of diode strings for ESD protection.
Microelectronics Reliability 47(7): 1044-1053 (2007) |
| 17 |  | P. Solomalala,
J. Saiz,
Michel Mermet-Guyennet,
Alberto Castellazzi,
Mauro Ciappa,
X. Chauffleur,
J. P. Fradin:
Virtual reliability assessment of integrated power switches based on multi-domain simulation approach.
Microelectronics Reliability 47(9-11): 1343-1348 (2007) |
| 16 |  | D. Barlini,
Mauro Ciappa,
Michel Mermet-Guyennet,
Wolfgang Fichtner:
Measurement of the transient junction temperature in MOSFET devices under operating conditions.
Microelectronics Reliability 47(9-11): 1707-1712 (2007) |
| 15 |  | Alberto Castellazzi,
Mauro Ciappa,
Wolfgang Fichtner,
M. Piton,
Michel Mermet-Guyennet:
A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs.
Microelectronics Reliability 47(9-11): 1713-1718 (2007) |
| 14 |  | J. Urresti-Ibañez,
Alberto Castellazzi,
M. Piton,
J. Rebollo,
Michel Mermet-Guyennet,
Mauro Ciappa:
Robustness test and failure analysis of IGBT modules during turn-off.
Microelectronics Reliability 47(9-11): 1725-1729 (2007) |
| 2006 |
| 13 |  | Marco Buzzo,
Mauro Ciappa,
Wolfgang Fichtner:
Characterization of photonic devices by secondary electron potential contrast.
Microelectronics Reliability 46(9-11): 1536-1541 (2006) |
| 12 |  | Alberto Castellazzi,
Mauro Ciappa,
Wolfgang Fichtner,
G. Lourdel,
Michel Mermet-Guyennet:
Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications.
Microelectronics Reliability 46(9-11): 1754-1759 (2006) |
| 11 |  | D. Barlini,
Mauro Ciappa,
Alberto Castellazzi,
Michel Mermet-Guyennet,
Wolfgang Fichtner:
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions.
Microelectronics Reliability 46(9-11): 1772-1777 (2006) |
| 2005 |
| 10 |  | Mauro Ciappa:
Lifetime prediction on the base of mission profiles.
Microelectronics Reliability 45(9-11): 1293-1298 (2005) |
| 9 |  | Marco Buzzo,
Mauro Ciappa,
Maria Stangoni,
Wolfgang Fichtner:
Two-dimensional Dopant Profiling and Imaging of 4H Silicon Carbide Devices by Secondary Electron Potential Contrast.
Microelectronics Reliability 45(9-11): 1499-1504 (2005) |
| 8 |  | Maria Stangoni,
Mauro Ciappa,
Wolfgang Fichtner:
Assessment of the Analytical Capabilities of Scanning Capacitance and Scanning Spreading Resistance Microscopy Applied to Semiconductor Devices.
Microelectronics Reliability 45(9-11): 1532-1537 (2005) |
| 7 |  | Mauro Ciappa,
Wolfgang Fichtner,
T. Kojima,
Y. Yamada,
Y. Nishibe:
Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles.
Microelectronics Reliability 45(9-11): 1694-1699 (2005) |
| 2003 |
| 6 |  | Maria Stangoni,
Mauro Ciappa,
Wolfgang Fichtner:
A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy.
Microelectronics Reliability 43(9-11): 1651-1656 (2003) |
| 5 |  | G. Mura,
Massimo Vanzi,
Maria Stangoni,
Mauro Ciappa,
Wolfgang Fichtner:
On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices.
Microelectronics Reliability 43(9-11): 1771-1776 (2003) |
| 2002 |
| 4 |  | Mauro Ciappa:
Selected failure mechanisms of modern power modules.
Microelectronics Reliability 42(4-5): 653-667 (2002) |
| 3 |  | Mauro Ciappa,
Flavio Carbognani,
P. Cova,
Wolfgang Fichtner:
A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors.
Microelectronics Reliability 42(9-11): 1653-1658 (2002) |
| 2 |  | Maria Stangoni,
Mauro Ciappa,
Marco Buzzo,
M. Leicht,
Wolfgang Fichtner:
Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction.
Microelectronics Reliability 42(9-11): 1701-1706 (2002) |
| 2001 |
| 1 |  | H. Yabuhara,
Mauro Ciappa,
Wolfgang Fichtner:
Diamond-Coated Cantilevers for Scanning Capacitance Microscopy Applications.
Microelectronics Reliability 41(9-10): 1459-1463 (2001) |