T. Y. Chung

	2010
1		H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T. Y. Chung, C. Y. Liu: Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces. Microelectronics Reliability 50(8): 1159-1162 (2010)

Coauthor Index

1	Y. C. Chuang	[1]
2	Y. H. Hsiao	[1]
3	P. L. Liao	[1]
4	C. Y. Liu	[1]
5	C. T. Lu	[1]
6	H. W. Tseng	[1]

Last update Sun May 27 04:04:01 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page