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- CSB - MetaPress - Google - Bing - Yahoo
 | 2010 | |
|---|---|---|
| 2 |      | De-Shin Liu, Zhen-Wei Zhuang, Ching-Yang Chen, Cho-Liang Chung: Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method. Microelectronics Reliability 50(1): 106-115 (2010) |
| 2005 | ||
| 1 | | Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee: Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). Microelectronics Reliability 45(12): 1916-1923 (2005) |
| 1 | Ching-Yang Chen | [2] |
| 2 | Yao-Jung Lee | [1] |
| 3 | De-Shin Liu | [2] |
| 4 | Liang-Tien Lu | [1] |
| 5 | Zhen-Wei Zhuang | [2] |
Colors in the list of coauthors
Last update Tue May 29 01:28:40 2012 CET by the DBLP Team —
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