Hyun-Suk Chun

	2008
2		Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung: Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectronics Reliability 48(11-12): 1857-1863 (2008)
	2007
1		Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung: Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR abs/0711.3323: (2007)

Coauthor Index

1	Seung-Boo Jung	[1] [2]
2	Jong-Woong Kim	[2]
3	Ja-Myeong Koo	[1] [2]
4	Hoo-Jeong Lee	[2]
5	Bo-In Noh	[2]
6	Jeong-Won Yoon	[1] [2]

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