 | 2005 |
|---|
| 5 |       | Y. F. Yao,
B. Njoman,
K. H. Chua,
T. Y. Lin:
New encapsulation development for fine pitch IC devices.
Microelectronics Reliability 45(7-8): 1222-1229 (2005) |
| 2004 |
|---|
| 4 | | T. Y. Lin,
B. Njoman,
D. Crouthamel,
K. H. Chua,
S. Y. Teo,
Y. Y. Ma:
The impact of moisture in mold compound preforms on the warpage of PBGA packages.
Microelectronics Reliability 44(4): 603-609 (2004) |
| 2003 |
|---|
| 3 | | Y. F. Yao,
T. Y. Lin,
K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP).
Microelectronics Reliability 43(12): 2039-2045 (2003) |
| 2 | | T. Y. Lin,
C. M. Fang,
Y. F. Yao,
K. H. Chua:
Development of the green plastic encapsulation for high density wirebonded leaded packages.
Microelectronics Reliability 43(5): 811-817 (2003) |
| 2002 |
|---|
| 1 | | T. Y. Lin,
W. S. Leong,
K. H. Chua,
R. Oh,
Y. Miao,
J. S. Pan,
J. W. Chai:
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.
Microelectronics Reliability 42(3): 375-380 (2002) |
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