F. Y. Chou

	2001
1		W. D. Zhuang, P. C. Chang, F. Y. Chou, R. K. Shiue: Effect of solder creep on the reliability of large area die attachment. Microelectronics Reliability 41(12): 2011-2021 (2001)

Coauthor Index

1	P. C. Chang	[1]
2	R. K. Shiue	[1]
3	W. D. Zhuang	[1]

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