Xian Tong Chen

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2005

1 Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen: Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectronics Reliability 45(9-11): 1443-1448 (2005)

	2005
1		Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen: Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectronics Reliability 45(9-11): 1443-1448 (2005)

Coauthor Index

1 Rakesh Kumar [1]

2 Arijit Roy [1]

3 Cher Ming Tan [1]

Last update Sun May 27 04:04:01 2012 CET by the DBLP Team —

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