 | 2011 |
|---|
| 7 |       | Hsien-Chie Cheng,
Kun-Yu Hsieh,
Kuo-Ming Chen:
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology.
Microelectronics Reliability 51(4): 826-836 (2011) |
| 2007 |
|---|
| 6 | | Lih-Chyau Wuu,
Tzong-Jye Liu,
Kuo-Ming Chen:
A longest prefix first search tree for IP lookup.
Computer Networks 51(12): 3354-3367 (2007) |
| 5 | | Yi-Shao Lai,
Kuo-Ming Chen,
Chin-Li Kao,
Chiu-Wen Lee,
Ying-Ta Chiu:
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.
Microelectronics Reliability 47(8): 1273-1279 (2007) |
| 2006 |
|---|
| 4 | | Kuo-Ming Chen,
J. D. Wu,
Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
Microelectronics Reliability 46(12): 2104-2111 (2006) |
| 3 | | Kuo-Ming Chen,
Kuo-Hsiung Houng,
Kuo-Ning Chiang:
Thermal resistance analysis and validation of flip chip PBGA packages.
Microelectronics Reliability 46(2-4): 440-448 (2006) |
| 2004 |
|---|
| 2 |  | Kuo-Ming Chen,
Yuan-Tsung Chen,
Ming-Shi Wang:
Reconstruction and Fusion of Multi-modality Spinal Images.
CISST 2004: 151-157 |
| 2003 |
|---|
| 1 | | Kuo-Ming Chen,
Kuo-Ning Chiang:
Impact of probing procedure on flip chip reliability.
Microelectronics Reliability 43(1): 123-130 (2003) |
Data released under the ODC-BY 1.0 license — See also our legal information page