Kuan-Neng Chen

	2012
9		Cheng-Ta Ko, Kuan-Neng Chen: Low temperature bonding technology for 3D integration. Microelectronics Reliability 52(2): 302-311 (2012)
8		Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen: Wafer-level Cu-Cu bonding technology. Microelectronics Reliability 52(2): 312-320 (2012)
7		S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen: BCB-to-oxide bonding technology for 3D integration. Microelectronics Reliability 52(2): 352-355 (2012)
	2011
6		Kuan-Neng Chen, Chuan Seng Tan: Integration schemes and enabling technologies for three-dimensional integrated circuits. IET Computers & Digital Techniques 5(3): 160-168 (2011)
	2010
5		Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen: Wafer-level 3D integration using hybrid bonding. 3DIC 2010: 1-4
4		Cheng-Ta Ko, Kuan-Neng Chen: Wafer-level bonding/stacking technology for 3D integration. Microelectronics Reliability 50(4): 481-488 (2010)
	2008
3		Steven J. Koester, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe Jr., Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis: Wafer-level 3D integration technology. IBM Journal of Research and Development 52(6): 583-597 (2008)
	2004
2		Shamik Das, Andy Fan, Kuan-Neng Chen, Chuan Seng Tan, Nisha Checka, Rafael Reif: Technology, performance, and computer-aided design of three-dimensional integrated circuits. ISPD 2004: 108-115
	2002
1		Rafael Reif, Andy Fan, Kuan-Neng Chen, Shamik Das: Fabrication Technologies for Three-Dimensional Integrated Circuits (invited). ISQED 2002: 33-37

Coauthor Index

1	Yao-Jen Chang	[8]
2	Nisha Checka	[2]
3	Yu-Hua Chen	[5]
4	Chuan-An Cheng	[5]
5	Shamik Das	[1] [2]
6	Andy Fan	[1] [2]
7	Huan-Chun Fu	[5]
8	Zhi-Cheng Hsiao	[5]
9	W. C. Huang	[7]
10	Wen-Chun Huang	[5]
11	C. T. Ko	[7]
12	Cheng-Ta Ko	[4] [5] [9]
13	Steven J. Koester	[3]
14	S. L. Lin	[7]
15	Wei-Chung Lo	[5]
16	Sampath Purushothaman	[3]
17	Narender Rana	[3]
18	Rafael Reif	[1] [2]
19	Leathen Shi	[3]
20	Edmund J. Sprogis	[3]
21	Chuan Seng Tan	[2] [6]
22	Ya-Sheng Tang	[8]
23	Douglas C. La Tulipe Jr.	[3]
24	Matthew R. Wordeman	[3]
25	Albert M. Young	[3]
26	Roy R. Yu	[3]

Colors in the list of coauthors

Last update Tue May 29 01:28:40 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page