N. Chawla

	2011
3		H. X. Xie, N. Chawla, Y.-L. Shen: Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys. Microelectronics Reliability 51(6): 1142-1147 (2011)
	2009
2		L. M. Taft, R. Scott Evans, C. R. Shyu, M. J. Egger, N. Chawla, J. A. Mitchell, Sidney N. Thornton, B. Bray, Michael W. Varner: Countering imbalanced datasets to improve adverse drug event predictive models in labor and delivery. Journal of Biomedical Informatics 42(2): 356-364 (2009)
1		S. M. Hayes, N. Chawla, D. R. Frear: Interfacial fracture toughness of Pb-free solders. Microelectronics Reliability 49(3): 269-287 (2009)

Coauthor Index

1	B. Bray	[2]
2	M. J. Egger	[2]
3	R. Scott Evans	[2]
4	D. R. Frear	[1]
5	S. M. Hayes	[1]
6	J. A. Mitchell	[2]
7	Y.-L. Shen	[3]
8	C. R. Shyu	[2]
9	L. M. Taft	[2]
10	Sidney N. Thornton	[2]
11	Michael W. Varner	[2]
12	H. X. Xie	[3]

Colors in the list of coauthors

Last update Tue May 29 01:28:40 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page