Ritwik Chatterjee

	2010
5		Syed M. Alam, Robert E. Jones, Scott Pozder, Ritwik Chatterjee, Shahid Rauf, Ankur Jain: Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration. IEEE Trans. VLSI Syst. 18(3): 450-460 (2010)
4		Ioannis Savidis, Syed M. Alam, Ankur Jain, Scott Pozder, Robert E. Jones, Ritwik Chatterjee: Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. Microelectronics Journal 41(1): 9-16 (2010)
	2009
3		Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala: Electrical modeling of Through Silicon and Package Vias. 3DIC 2009: 1-8
2		Rao R. Tummala, Venky Sundaram, Ritwik Chatterjee, P. Markodeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Vikay Sridharan, Abhishek Choudury, Qiao Chen, Tapobrata Bandyopadhyay: Trend from ICs to 3D ICs to 3D systems. CICC 2009: 439-444
	2007
1		Syed M. Alam, Robert E. Jones, Shahid Rauf, Ritwik Chatterjee: Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology. ISQED 2007: 580-585

Coauthor Index

1	Syed M. Alam	[1] [4] [5]
2	Tapobrata Bandyopadhyay	[2] [3]
3	Qiao Chen	[2]
4	Abhishek Choudury	[2]
5	Daehyun Chung	[3]
6	Ankur Jain	[4] [5]
7	Robert E. Jones	[1] [4] [5]
8	Nitesh Kumbhat	[2]
9	Scott Pozder	[4] [5]
10	P. Markodeya Raj	[2]
11	Shahid Rauf	[1] [5]
12	Ioannis Savidis	[4]
13	Vikay Sridharan	[2]
14	Vijay Sukumaran	[2]
15	Venky Sundaram	[2]
16	Madhavan Swaminathan	[3]
17	Rao R. Tummala	[2] [3]

Colors in the list of coauthors

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