K. P. Chang

	2007
2		M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang: Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectronics Reliability 47(12): 2100-2108 (2007)
	2005
1		M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang: Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectronics Reliability 45(7-8): 1061-1078 (2005)

Coauthor Index

1	M. H. Lin	[1] [2]
2	Y. L. Lin	[1]
3	K. C. Su	[1] [2]
4	Tahui Wang	[1] [2]

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