Wenwen Chai

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2011

2 Wenwen Chai, Dan Jiao: Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects. DAC 2011: 206-211

2009

1 Wenwen Chai, Dan Jiao, Cheng-Kok Koh: A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction. DAC 2009: 752-757

	2011
2		Wenwen Chai, Dan Jiao: Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects. DAC 2011: 206-211
	2009
1		Wenwen Chai, Dan Jiao, Cheng-Kok Koh: A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction. DAC 2009: 752-757

Coauthor Index

1 Dan Jiao [1] [2]

2 Cheng-Kok Koh [1]

Last update Sun May 27 04:04:01 2012 CET by the DBLP Team —

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