 | 2010 |
|---|
| 7 |       | Y. C. Tan,
Cher Ming Tan,
Xiaowu Zhang,
Tai Chong Chai,
D. Q. Yu:
Electromigration performance of Through Silicon Via (TSV) - A modeling approach.
Microelectronics Reliability 50(9-11): 1336-1340 (2010) |
| 2008 |
|---|
| 6 | | Xiaowu Zhang,
Kripesh Vaidyanathan,
Tai Chong Chai,
Teck Chun Tan,
D. Pinjala:
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP).
Microelectronics Reliability 48(4): 602-610 (2008) |
| 2007 |
|---|
| 5 | | Cher Ming Tan,
Stanny Yanuar,
Tai Chong Chai:
Finite element modeling of capacitive coupling voltage contrast.
Microelectronics Reliability 47(9-11): 1555-1560 (2007) |
| 2006 |
|---|
| 4 | | Cher Ming Tan,
Zhenghao Gan,
Tai Chong Chai:
Feasibility study of the application of voltage contrast to printed circuit board.
Microelectronics Reliability 46(5-6): 939-948 (2006) |
| 2005 |
|---|
| 3 | | Cher Ming Tan,
Kim Peng Lim,
Tai Chong Chai,
Guat Cheng Lim:
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.
Microelectronics Reliability 45(9-11): 1572-1575 (2005) |
| 2004 |
|---|
| 2 | | Xiaowu Zhang,
E. H. Wong,
Charles Lee,
Tai Chong Chai,
Yiyi Ma,
Poi-Siong Teo,
D. Pinjala,
Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Microelectronics Reliability 44(4): 611-619 (2004) |
| 2002 |
|---|
| 1 | | Mohandass Sivakumar,
Kripesh Vaidyanathan,
Chong Ser Choong,
Tai Chong Chai,
Loon Aik Lim:
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly.
Microelectronics Reliability 42(9-11): 1535-1540 (2002) |
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