Alberto Castellazzi

	2010
12		F. Carastro, Alberto Castellazzi, J. C. Clare, P. W. Wheeler: Control technique for power device electro-thermal stress minimisation in non-linear load variable-frequency resonant power converters. Microelectronics Reliability 50(9-11): 1738-1743 (2010)
	2009
11		F. Carastro, Alberto Castellazzi, J. C. Clare, M. Johnson, M. Bland, P. W. Wheeler: Reliability considerations in pulsed power resonant conversion. Microelectronics Reliability 49(9-11): 1352-1357 (2009)
	2008
10		Alberto Castellazzi, Mauro Ciappa: Novel simulation approach for transient analysis and reliable thermal management of power devices. Microelectronics Reliability 48(8-9): 1500-1504 (2008)
	2007
9		P. Solomalala, J. Saiz, Michel Mermet-Guyennet, Alberto Castellazzi, Mauro Ciappa, X. Chauffleur, J. P. Fradin: Virtual reliability assessment of integrated power switches based on multi-domain simulation approach. Microelectronics Reliability 47(9-11): 1343-1348 (2007)
8		Alberto Castellazzi, Mauro Ciappa, Wolfgang Fichtner, M. Piton, Michel Mermet-Guyennet: A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs. Microelectronics Reliability 47(9-11): 1713-1718 (2007)
7		J. Urresti-Ibañez, Alberto Castellazzi, M. Piton, J. Rebollo, Michel Mermet-Guyennet, Mauro Ciappa: Robustness test and failure analysis of IGBT modules during turn-off. Microelectronics Reliability 47(9-11): 1725-1729 (2007)
6		X. Perpiñà, Alberto Castellazzi, M. Piton, Michel Mermet-Guyennet, José Millán: Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities. Microelectronics Reliability 47(9-11): 1784-1789 (2007)
	2006
5		Alberto Castellazzi, Martin Honsberg-Riedl, Gerhard K. M. Wachutka: Thermal characterisation of power devices during transient operation. Microelectronics Journal 37(2): 145-151 (2006)
4		Alberto Castellazzi, Mauro Ciappa, Wolfgang Fichtner, G. Lourdel, Michel Mermet-Guyennet: Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications. Microelectronics Reliability 46(9-11): 1754-1759 (2006)
3		D. Barlini, Mauro Ciappa, Alberto Castellazzi, Michel Mermet-Guyennet, Wolfgang Fichtner: New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions. Microelectronics Reliability 46(9-11): 1772-1777 (2006)
	2003
2		Alberto Castellazzi, V. Kartal, R. Kraus, N. Seliger, Martin Honsberg-Riedl, Doris Schmitt-Landsiedel: Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET's. Microelectronics Reliability 43(9-11): 1877-1882 (2003)
	2002
1		Alberto Castellazzi, R. Kraus, N. Seliger, Doris Schmitt-Landsiedel: Reliability analysis of power MOSFET's with the help of compact models and circuit simulation. Microelectronics Reliability 42(9-11): 1605-1610 (2002)

Coauthor Index

1	D. Barlini	[3]
2	M. Bland	[11]
3	F. Carastro	[11] [12]
4	X. Chauffleur	[9]
5	Mauro Ciappa	[3] [4] [7] [8] [9] [10]
6	J. C. Clare	[11] [12]
7	Wolfgang Fichtner	[3] [4] [8]
8	J. P. Fradin	[9]
9	Martin Honsberg-Riedl	[2] [5]
10	M. Johnson	[11]
11	V. Kartal	[2]
12	R. Kraus	[1] [2]
13	G. Lourdel	[4]
14	Michel Mermet-Guyennet	[3] [4] [6] [7] [8] [9]
15	José Millán	[6]
16	X. Perpiñà	[6]
17	M. Piton	[6] [7] [8]
18	J. Rebollo	[7]
19	J. Saiz	[9]
20	Doris Schmitt-Landsiedel	[1] [2]
21	N. Seliger	[1] [2]
22	P. Solomalala	[9]
23	J. Urresti-Ibañez (J. Urresti)	[7]
24	Gerhard K. M. Wachutka	[5]
25	P. W. Wheeler	[11] [12]

Colors in the list of coauthors

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