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| 2007 | ||
|---|---|---|
| 1 | Kerry Bernstein, Paul Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steven J. Koester, John Magerlein, Ruchir Puri, Albert M. Young: Interconnects in the Third Dimension: Design Challenges for 3D ICs. DAC 2007: 562-567 | |
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