J. F. J. M. Caers

	2009
3		E. H. Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai: Advances in the drop-impact reliability of solder joints for mobile applications. Microelectronics Reliability 49(2): 139-149 (2009)
	2008
2		E. H. Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh: Correlation studies for component level ball impact shear test and board level drop test. Microelectronics Reliability 48(7): 1069-1078 (2008)
	2005
1		Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao: Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectronics Reliability 45(7-8): 1215-1221 (2005)

Coauthor Index

1	Willem D. van Driel (W. D. van Driel)	[2] [3]
2	P. L. Eu	[2]
3	Mahadevan K. Iyer	[1]
4	Y.-S. Lai	[2] [3]
5	M. Leoni	[2]
6	N. Owens	[2] [3]
7	Ranjan Rajoo	[1] [2]
8	S. K. W. Seah	[2] [3]
9	C. S. Selvanayagam	[2]
10	L. C. Tan	[2]
11	E. H. Wong	[1] [2] [3]
12	C.-L. Yeh	[2]
13	Xiaowu Zhang	[1]
14	X. J. Zhao	[1] [2]

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