William E. Burdick Jr.

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1994

2 William E. Burdick Jr., Wolfgang Daum: High-Yield Multichip Modules Based on Minimal IC Pretest. ITC 1994: 30-40

1993

1 Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion: Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. IEEE Computer 26(4): 23-29 (1993)

	1994
2		William E. Burdick Jr., Wolfgang Daum: High-Yield Multichip Modules Based on Minimal IC Pretest. ITC 1994: 30-40
	1993
1		Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion: Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. IEEE Computer 26(4): 23-29 (1993)

Coauthor Index

1 Wolfgang Daum [1] [2]

2 Raymond A. Fillion [1]

Last update Sun May 27 04:04:01 2012 CET by the DBLP Team —

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