 | 2012 |
|---|
| 10 |       | Patrick Ruch,
Thomas Brunschwiler,
Werner Escher,
Stephan Paredes,
Bruno Michel:
Bionic Packaging: A Promising Paradigm for Future Computing.
ERCIM News 2012(89): (2012) |
| 2011 |
|---|
| 9 | | Mohamed M. Sabry,
Arvind Sridhar,
David Atienza,
Yuksel Temiz,
Yusuf Leblebici,
S. Szczukiewicz,
N. Borhani,
J. R. Thome,
Thomas Brunschwiler,
Bruno Michel:
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling.
DATE 2011: 1466-1471 |
| 8 | | Patrick Ruch,
Thomas Brunschwiler,
Werner Escher,
Stephan Paredes,
Bruno Michel:
Toward five-dimensional scaling: How density improves efficiency in future computers.
IBM Journal of Research and Development 55(5): 15 (2011) |
| 7 | | Mohamed M. Sabry,
Ayse Kivilcim Coskun,
David Atienza,
Tajana Simunic Rosing,
Thomas Brunschwiler:
Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures.
IEEE Trans. on CAD of Integrated Circuits and Systems 30(12): 1883-1896 (2011) |
| 2010 |
|---|
| 6 | | Ayse Kivilcim Coskun,
David Atienza,
Tajana Simunic Rosing,
Thomas Brunschwiler,
Bruno Michel:
Energy-efficient variable-flow liquid cooling in 3D stacked architectures.
DATE 2010: 111-116 |
| 5 | | Arvind Sridhar,
Alessandro Vincenzi,
Martino Ruggiero,
Thomas Brunschwiler,
David Atienza:
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling.
ICCAD 2010: 463-470 |
| 2009 |
|---|
| 4 | | Thomas Brunschwiler,
Stephan Paredes,
Ute Drechsler,
Bruno Michel,
W. Cesar,
G. Toral,
Yuksel Temiz,
Yusuf Leblebici:
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks.
3DIC 2009: 1-10 |
| 3 | | Gerhard Ingmar Meijer,
Thomas Brunschwiler,
Stephan Paredes,
Bruno Michel:
Using Waste Heat from Data Centres to Minimize Carbon Dioxide Emission.
ERCIM News 2009(79): (2009) |
| 2 | | Thomas Brunschwiler,
Brian Smith,
E. Ruetsche,
Bruno Michel:
Toward zero-emission data centers through direct reuse of thermal energy.
IBM Journal of Research and Development 53(3): 11 (2009) |
| 1 | | Brian Smith,
Thomas Brunschwiler,
Bruno Michel:
Comparison of transient and static test methods for chip-to-sink thermal interface characterization.
Microelectronics Journal 40(9): 1379-1386 (2009) |
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