Peter J. Brofman

	2005
3		Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad: Effects of mechanical stress and moisture on packaging interfaces. IBM Journal of Research and Development 49(4-5): 663-676 (2005)
	2002
2		John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth: An advanced multichip module (MCM) for high-performance UNIX servers. IBM Journal of Research and Development 46(6): 779-804 (2002)
	1992
1		Peter J. Brofman, Sudipta K. Ray, Keith F. Beckham: Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors. IBM Journal of Research and Development 36(5): 921-934 (1992)

Coauthor Index

1	Keith F. Beckham	[1]
2	Stephen L. Buchwalter	[3]
3	Patrick A. Coico	[2]
4	David L. Edwards	[2]
5	Benjamin V. Fasano	[2]
6	Claudius Feger	[3]
7	Michael A. Gaynes	[3]
8	Lewis S. (Lew) Goldmann	[2]
9	Harvey C. Hamel	[2]
10	Anand Haridass	[2]
11	James N. Humenik	[2]
12	Sushumna Iruvanti	[2]
13	John U. Knickerbocker	[2]
14	Kang-Wook Lee	[3]
15	Thomas E. Lombardi	[2]
16	Hai P. Longworth	[2]
17	Kenneth C. Marston	[2]
18	Luis J. Matienzo	[3]
19	Michael G. Nealon	[2]
20	Frank L. Pompeo	[2]
21	Kevin M. Prettyman	[2]
22	David L. Questad	[3]
23	Sudipta K. Ray	[1] [2]
24	Srinivasa N. Reddy	[2]
25	Richard A. Shelleman	[2]
26	Subhash L. Shinde	[2]
27	Alice F. Tai	[2]
28	Donald L. Thomas	[2]
29	Roger D. Weekly	[2]
30	Jeffrey A. Zitz	[2]

Colors in the list of coauthors

Last update Sun May 27 04:04:01 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page