Dusan Boroyevich

	2001
1		Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu: Design issues of a three-dimensional packaging scheme for power modules. Microelectronics Reliability 41(2): 295-305 (2001)

Coauthor Index

1	Mike Craven	[1]
2	Shatil Haque	[1]
3	Xingsheng Liu	[1]
4	Guo-Quan Lu	[1]
5	Kalyan Siddabattula	[1]
6	Sihua Wen	[1]

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