 | 2009 |
| 4 |  | L. France,
N. Ouillon,
G. Chazot,
J. Kornprobst,
P. Boivin:
CMAS 3D, a new program to visualize and project major elements compositions in the CMAS system.
Computers & Geosciences 35(6): 1304-1310 (2009) |
| 2007 |
| 3 |  | Nicolas Baboux,
C. Busseret,
C. Plossu,
P. Boivin:
Peculiarities of electron tunnel injection to the drain of EEPROMs.
Microelectronics Reliability 47(4-5): 631-634 (2007) |
| 2005 |
| 2 |  | D. Goguenheim,
A. Bravaix,
S. Gomri,
J. M. Moragues,
C. Monserie,
N. Legrand,
P. Boivin:
Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies.
Microelectronics Reliability 45(3-4): 487-492 (2005) |
| 1 |  | Nicolas Baboux,
C. Plossu,
P. Boivin:
Dynamic Fowler-Nordheim injection in EEPROM tunnel oxides at realistic time scales.
Microelectronics Reliability 45(5-6): 911-914 (2005) |