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| 2005 | ||
|---|---|---|
| 2 | H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang: Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. Microelectronics Reliability 45(7-8): 1134-1143 (2005) | |
| 2003 | ||
| 1 | C. F. Tsang, V. N. Bliznetsov, Y. J. Su: Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. Microelectronics Journal 34(11): 1051-1058 (2003) | |
| 1 | H. Y. Li | [2] |
| 2 | S. M. Sohan | [2] |
| 3 | Y. J. Su | [1] [2] |
| 4 | C. F. Tsang | [1] [2] |
| 5 | L. Zhang | [2] |
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