Kees Beenakker

C. I. M. Beenakker

	2012
4		Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen: Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. J. Electronic Testing 28(1): 15-25 (2012)
	2010
3		Negin Golshani, Jaber Derakhshandeh, Ryoichi Ishihara, C. I. M. Beenakker, Michael Robertson, Thomas Morrison: Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. 3DIC 2010: 1-4
2		Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen: Test Cost Analysis for 3D Die-to-Wafer Stacking. Asian Test Symposium 2010: 435-441
	2006
1		Ryoichi Ishihara, Arie Glazer, Yoel Raab, Peter Rusian, Mannie Dorfan, Benzi Lavi, Ilya Leizerson, Albert Kishinevsky, Yvonne Van Andel, Xin Cao, Wim Metselaar, Kees Beenakker, Sara Stolyarova, Yael Nemirovsky: A Novel Selected Area Laser Assisted (SALA) System for Crystallization and Doping Processes in Low-Temperature Poly-Si Thin-Film Transistors. IEICE Transactions 89-C(10): 1377-1382 (2006)

Coauthor Index

1	Yvonne Van Andel	[1]
2	Xin Cao	[1]
3	Jaber Derakhshandeh	[3]
4	Mannie Dorfan	[1]
5	Arie Glazer	[1]
6	Negin Golshani	[3]
7	Said Hamdioui	[2] [4]
8	Ryoichi Ishihara	[1] [3]
9	Albert Kishinevsky	[1]
10	Benzi Lavi	[1]
11	Ilya Leizerson	[1]
12	Erik Jan Marinissen	[2] [4]
13	Wim Metselaar	[1]
14	Thomas Morrison	[3]
15	Yael Nemirovsky	[1]
16	Yoel Raab	[1]
17	Michael Robertson	[3]
18	Peter Rusian	[1]
19	Sara Stolyarova	[1]
20	Mottaqiallah Taouil	[2] [4]

Colors in the list of coauthors

Last update Sun May 27 04:04:01 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page