Jichoel Bea

	2010
4		Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC 2010: 1-4
3		Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5
2		Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5
	2009
1		Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: 10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6

Coauthor Index

1	Takafumi Fukushima	[1] [2] [3] [4]
2	Eiji Iwata	[3]
3	Mitsumasa Koyanagi	[1] [2] [3] [4]
4	Kang Wook Lee	[1] [2] [3] [4]
5	Mariappan Murugesan	[1] [2] [3]
6	Akihiro Noriki	[1] [4]
7	Yuki Ohara	[1] [2]
8	Katsuyuki Sakuma	[1]
9	Tetsu Tanaka	[1] [2] [3] [4]
10	Fumiaki Yamada	[1]

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