 | 2008 |
|---|
| 5 |       | Shidong Li,
Mohd F. Abdulhamid,
Cemal Basaran:
Simulating Damage Mechanics of Electromigration and Thermomigration.
Simulation 84(8-9): 391-401 (2008) |
| 2007 |
|---|
| 4 | | Cemal Basaran,
Minghui Lin,
Shidong Li:
Computational simulation of electromigration induced damage in copper interconnects.
SCSC 2007: 261-268 |
| 3 | | Cemal Basaran,
Juan Gomez,
Minghui Lin,
Shidong Li:
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.
SCSC 2007: 269-275 |
| 2 | | Cemal Basaran,
Michael Sellers,
David Kofke,
Andrew Schultz:
Strain energy change due to an atomic defect in solder alloy lattice.
SCSC 2007: 37 |
| 2003 |
|---|
| 1 | | Hua Ye,
Douglas C. Hopkins,
Cemal Basaran:
Measurement of high electrical current density effects in solder joints.
Microelectronics Reliability 43(12): 2021-2029 (2003) |
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