S. Barberan

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2005

1 S. Barberan, E. Auvray: Die repackaging for failure analysis. Microelectronics Reliability 45(9-11): 1576-1580 (2005)

	2005
1		S. Barberan, E. Auvray: Die repackaging for failure analysis. Microelectronics Reliability 45(9-11): 1576-1580 (2005)

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