 | 2010 |
|---|
| 5 |       | R. Charavel,
J. Roig,
S. Mouhoubi,
P. Gassot,
F. Bauwens,
P. Vanmeerbeek,
B. Desoete,
P. Moens,
Eddy De Backer:
Next generation of Deep Trench Isolation for Smart Power technologies with 120 V high-voltage devices.
Microelectronics Reliability 50(9-11): 1758-1762 (2010) |
| 2008 |
|---|
| 4 | | Jan Ackaert,
R. Charavel,
K. Dhondt,
B. Vlachakis,
Luc De Schepper,
M. Millecam,
E. Vandevelde,
P. Bogaert,
A. Iline,
Eddy De Backer,
A. Vlad,
Jean-Pierre Raskin:
MIMC reliability and electrical behavior defined by a physical layer property of the dielectric.
Microelectronics Reliability 48(8-9): 1553-1556 (2008) |
| 2003 |
|---|
| 3 | | Jan Ackaert,
Klara Bessemans,
Eddy De Backer:
Charging induced damage by photoconduction through thick inter metal dielectrics.
Microelectronics Reliability 43(9-11): 1525-1529 (2003) |
| 2001 |
|---|
| 2 | | Peter Coppens,
Guido Vanhorebeek,
Eddy De Backer:
Correlation between predicted cause of SRAM failures and in-line defect data.
Microelectronics Reliability 41(1): 53-57 (2001) |
| 1 |  | Jan Ackaert,
Z. Wang,
Eddy De Backer,
P. Colson,
Peter Coppens:
Non Contact Surface Potential Measurements for Charging Reduction During Manufacturing of Metal-Insulator-Metal Capacitors.
Microelectronics Reliability 41(9-10): 1403-1407 (2001) |
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