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| 2005 | ||
|---|---|---|
| 1 | K. C. Lee, A. Vythilingam, P. Alpern: A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages. Microelectronics Reliability 45(9-11): 1668-1671 (2005) | |
| 1 | K. C. Lee | [1] |
| 2 | A. Vythilingam | [1] |
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