Syed M. Alam

	2011
20		Nauman H. Khan, Syed M. Alam, Soha Hassoun: Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs. ISQED 2011: 751-756
19		Jayita Das, Syed M. Alam, Srinath Rajaram, Sanjukta Bhanja: Hybrid CMOS-MQCA Logic Architectures using Multi-Layer Spintronic Devices CoRR abs/1102.4034: (2011)
18		Nauman H. Khan, Syed M. Alam, Soha Hassoun: Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies. IEEE Trans. VLSI Syst. 19(4): 647-658 (2011)
17		Ankur Jain, Syed M. Alam, Scott Pozder, Robert E. Jones: Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints. IET Computers & Digital Techniques 5(3): 169-178 (2011)
16		Karthikeyan Lingasubramanian, Syed M. Alam, Sanjukta Bhanja: Maximum error modeling for fault-tolerant computation using maximum a posteriori (MAP) hypothesis. Microelectronics Reliability 51(2): 485-501 (2011)
	2010
15		Alodeep Sanyal, Syed M. Alam, Sandip Kundu: BIST to Detect and Characterize Transient and Parametric Failures. IEEE Design & Test of Computers 27(5): 50-59 (2010)
14		Syed M. Alam, Robert E. Jones, Scott Pozder, Ritwik Chatterjee, Shahid Rauf, Ankur Jain: Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration. IEEE Trans. VLSI Syst. 18(3): 450-460 (2010)
13		Ioannis Savidis, Syed M. Alam, Ankur Jain, Scott Pozder, Robert E. Jones, Ritwik Chatterjee: Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. Microelectronics Journal 41(1): 9-16 (2010)
	2009
12		Nauman H. Khan, Syed M. Alam, Soha Hassoun: System-level comparison of power delivery design for 2D and 3D ICs. 3DIC 2009: 1-7
11		Nauman H. Khan, Syed M. Alam, Soha Hassoun: Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs. 3DIC 2009: 1-7
10		Syed M. Alam, Robert E. Jones, Scott Pozder, Ankur Jain: Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. ISQED 2009: 569-575
9		Karthikeyan Lingasubramanian, Syed M. Alam, Sanjukta Bhanja: Study of Circuit-Specific Error Bounds for Fault-Tolerant Computation using Maximum a posteriori (MAP) Hypothesis CoRR abs/0906.3282: (2009)
	2008
8		Syed M. Alam, Mike Ignatowski, Yuan Xie: Technology, CAD tools, and designs for emerging 3D integration technology. ACM Great Lakes Symposium on VLSI 2008: 1-2
7		Alodeep Sanyal, Syed M. Alam, Sandip Kundu: A Built-In Self-Test Scheme for Soft Error Rate Characterization. IOLTS 2008: 65-70
	2007
6		Syed M. Alam, Robert E. Jones, Shahid Rauf, Ritwik Chatterjee: Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology. ISQED 2007: 580-585
5		Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel: Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectronics Journal 38(4-5): 463-473 (2007)
	2005
4		Syed M. Alam, Donald E. Troxel, Carl V. Thompson: Thermal aware cell-based full-chip electromigration reliability analysis. ACM Great Lakes Symposium on VLSI 2005: 26-31
3		Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel: Electromigration Reliability Comparison of Cu and Al Interconnects. ISQED 2005: 303-308
	2004
2		Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel: Circuit Level Reliability Analysis of Cu Interconnects. ISQED 2004: 238-243
	2002
1		Syed M. Alam, Donald E. Troxel, Carl V. Thompson: A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits. ISQED 2002: 246-251

Coauthor Index

1	Sanjukta Bhanja	[9] [16] [19]
2	Ritwik Chatterjee	[6] [13] [14]
3	Jayita Das	[19]
4	Chee Lip Gan	[2] [3] [5]
5	Soha Hassoun	[11] [12] [18] [20]
6	Mike Ignatowski	[8]
7	Ankur Jain	[10] [13] [14] [17]
8	Robert E. Jones	[6] [10] [13] [14] [17]
9	Nauman H. Khan	[11] [12] [18] [20]
10	Sandip Kundu	[7] [15]
11	Karthikeyan Lingasubramanian	[9] [16]
12	Scott Pozder	[10] [13] [14] [17]
13	Srinath Rajaram	[19]
14	Shahid Rauf	[6] [14]
15	Alodeep Sanyal	[7] [15]
16	Ioannis Savidis	[13]
17	Carl V. Thompson	[1] [2] [3] [4] [5]
18	Donald E. Troxel	[1] [2] [3] [4] [5]
19	Frank L. Wei	[3]
20	Yuan Xie	[8]

Colors in the list of coauthors

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