 | 2011 |
|---|
| 6 |       | Ibrahim Ahmad,
Azizah Jaafar:
Game Design Framework: A Pilot Study on Users' Perceptions.
IVIC (2) 2011: 33-38 |
| 2009 |
|---|
| 5 | | Nowshad Amin,
Victor Lim,
Foong Chee Seng,
Rozaidi Razid,
Ibrahim Ahmad:
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages.
Microelectronics Reliability 49(5): 537-543 (2009) |
| 2008 |
|---|
| 4 | | Arrul Azlan Hamzah,
Yusnira Husaini,
Burhanuddin Yeop Majlis,
Ibrahim Ahmad:
Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging
CoRR abs/0802.3086: (2008) |
| 2007 |
|---|
| 3 | | Mohd Khairuddin Md Arshad,
Azman Jalar,
Ibrahim Ahmad:
Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process.
Microelectronics Reliability 47(7): 1120-1126 (2007) |
| 2006 |
|---|
| 2 | | Mohd Khairuddin Md Arshad,
Ibrahim Ahmad,
Azman Jalar,
Ghazali Omar:
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition.
Microelectronics Reliability 46(2-4): 367-379 (2006) |
| 1 | | Hoh Huey Jiun,
Ibrahim Ahmad,
Azman Jalar,
Ghazali Omar:
Effect of wafer thinning methods towards fracture strength and topography of silicon die.
Microelectronics Reliability 46(5-6): 836-845 (2006) |
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