ITC 2014: Seattle, WA, USA

Session 1 - What new defects will new technologies bring?

Session 2 - Modeling and measuring complex analog behaviours

Session 3 - Security: From chips to the Internet of Things

Session 4 - Robust energy systems

Session 5 - Discussion session: Has adaptive test lived up to its expectations?

Session 6 - More test compression: Cadence, Mentor, Synopsys

Session 7 - Tackling timing and power during test

Session 8 - Learn from the experts: High volume manufacturing

Session 9 - RF Test: Digital ate, radios, radars

Session 10 - "Fool" nyquist, fix nonlinearity, tolerate jitter

Session 11 - Embedded systems: From firmware to large-scale applications

Session 12 - Test enables technology bringup

Session 14 - Advances in packaging and probing

Session 15 - Building robust systems: Under test and in the wild

Session 16 - Emerging SOS challenges

Session 17 - Coding, coverage, vmin, and repair: Tradeoffs in today's embedded memories

Session 18 - Big data: Big problem or opportunity for test?

Session 19 - Statistical apporaches to AMS design and test

Session 20 - Test and yield go 3-D

Session 21 - Boards and test: Not your dad's board test

Session 22 - Validation: Pre-silicon, emulation, post-silicon

Session 23 - RAM test and repair: Today and tomorrow

Session 24 - Connecting process variation, yield, and diagnosis

Session 25 - Functional testing: A fresh look

Session 26 - Think you know ATPG? Think again

Session 27 - Stay "tuned" for analog testing

Session 28 - Attacks and countermeasures for secure chips

Session 29 - Logic test compression + logic bist

Session 30 - What's wrong with my chip?

IEEE TTTC E. J. McCluskey Doctoral Dissertation Competition: Final Round

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