22nd Asian Test Symposium 2013: Yilan County, Taiwan

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Session 4A: 3D-IC Design-for-Test

Session 4B: Power/Thermal Aware Testing I

Session 5A: At-Speed Testing

Session 5B: Analog/Mixed-Signal Test

Session 6A: Diagnosis and Debugging

Session 6B: Design-for-Test I

Session 6C: Industry Session I

Session 7A: Memory Defects

Session 7B: Converter Testing

Session 8A: 3D-IC Interposer Test

Session 8B: Power/Thermal Aware Testing II

Session 9A: Defect-Based Test

Session 9B: Design-for-Test II

Session 9C: Industry Session II

Session 10A: Memory Testing

Session 10B: Automatic Test Pattern Generation

Session 11A: Process Variations

Session 11B: High-Speed I/O Testing

Session 11C: Yield Enhancement and Security

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